| Characteristic |
Bare
Copper (CU) |
Tin Plated
Copper (TC) |
Silver Plated Copper (SC) |
Nickel Plated Copper (NC) |
| Life
Stability |
Excellent
- Slight loss of conductivity with heat aging |
Conductivity
and solderability deteriorates with heat aging at rated
temperature due to migration of tin and copper and tin
oxidation |
Excellent
- no loss of conductivity with heat aging at rated
temperature. Solderability shelf life remains good. |
Conductivity
remains stable with heat aging at rated temperature. |
| Crimp
Terminability |
Excellent
- Contact resistance may vary with type of terminal |
Good
- but contact resistance increases with time and can be
variable |
Excellent
- contact resistance remains low |
Good
- but contact resistance may vary with time. Use plated
steel terminal in some cases. |
| Solder |
Good
- When clean |
Good
originally. Deteriorates with shelf life. |
Excellent |
Requires
active flux |
| Service
Temperature |
210
ºF (99 ºC) |
300
ºF (149 ºC) |
390
ºF (199 ºC) |
480
ºF (249 ºC) |
